3D集成電路將如何同時實現？

　　Author Information

　　Philip Garrou consults in the areas of thin-film microelectronics, IC packaging and materials for microelectronics. He was previously global director of technology and new business development of Dow Chemical's Advanced Electronic Materials business. Garrou is a Fellow of IEEE and IMAPS, and has served as president of the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) and IMAPS. He has a B.S. in chemistry from North Carolina State University and a Ph.D. in chemistry from Indiana University. e-mail: philgarrou@att.net

　　References

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　　5. P. Garrou, “3D Integration Invades Whitefish Montana,” Perspectives From the Leading Edge, Sept. 7, 2007.

　　6. P. Morrow et al., “Design and Fabrication of 3D Microprocessors,” MRS Proc., Vol. 970, Enabling Technologies for 3D Integration, C.Bower, P. Garrou, P. Ramm, K. Takahashi Eds., 2007, p. 91.

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　　18. Handbook of 3D Integration, P. Garrou, P. Ramm & C. Bower Eds., Wiley-VCH.